参数 |
数值 |
保存温度范围-Min |
-40Cel |
使用温度范围-Min |
-40Cel |
主体纵长(W)-Nom |
1.25 mm |
重量-Nom |
0.0072g |
最大功率-Max |
230 mW |
保存温度范围-Max |
125Cel |
主体横宽(L)-Nom |
2 mm |
公称B常数(B25/50)-Typ |
3392K |
公称零负荷电阻值的容许差 |
+/-5% |
公称零符合电阻值-Typ |
6.8 kOhm |
公称B常数的容许差 |
+/-3% |
表面安装分类 |
No |
公称B常数(B25/85)-Typ |
3450K |
类型 |
Chip Type |
最少供货数-Nom |
2000Pcs |
主体高度(T)-Nom |
0.7 mm |
最少包装数-Nom |
2000Pcs |
使用温度范围-Max |
125Cel |
尺寸代码 |
2012 |
包装形式 |
Punched (Paper)Taping [180mm Reel] |
依据国际标准 |
JIS C 2570 |
适用焊接方法 |
Reflow |
概要
This parts are eco-friendly product which does not contain a lead. It can choose from wide range resistance series.From 470ohms to 150Kohm
用途
CELLULAR,PC,ODD,BATTERY,LCD,PRINTER,HDD,BASE STATION,POWER AMP
特点
This product include no lead and applies to the EU Council Directive 2002/95/EC “RoHS”.This product realized excellent solderablity and soldering heat resistance, comparing with the conventional eutectic mixture solder and lead-free solder (Sn/Ag/Cu, etc.).By using layered internal electrode structure, product series provides a wide range of resistances - B constants and realized good stability of resistance value after soldering.