NTCG103EH300JT1

品牌:TDK
描述:
包装:Punched (Paper)Taping [180mm Reel]
封装:
无铅情况/ROHS: 有铅
类别:热敏电阻
经营商:科通芯城自营
参数 数值
公称B常数(B25/50)-Typ 3244K
公称零负荷电阻值的容许差 +/-5%
表面安装分类 No
尺寸代码 1005
最少供货数-Nom 10000Pcs
保存温度范围-Min -40Cel
使用温度范围-Min -40Cel
公称零符合电阻值-Typ 30Ohm
保存温度范围-Max 125Cel
最少包装数-Nom 10000Pcs
重量-Nom 0.0013g
包装形式 Punched (Paper)Taping [180mm Reel]
依据国际标准 JIS C 2570
最大功率-Max 35 mW
适用焊接方法 Reflow
公称B常数(B25/85)-Typ 3250K
类型 Chip Type
主体纵长(W)-Nom 0.5 mm
公称B常数的容许差 +/-3%
主体高度(T)-Nom 0.5 mm
使用温度范围-Max 125Cel
主体横宽(L)-Nom 1 mm
概要
A size of L1.0xW0.5xT0.5mm.It can choose from wide range resistance series.From 30ohms to 1Mohm
用途
CELLULAR,PC,ODD,BATTERY,LCD,PRINTER,HDD,BASE STATION,POWER AMP
特点
This product include no lead and applies to the EU Council Directive 2002/95/EC RoHS.This product realized excellent solderablity and soldering heat resistance, comparing with the conventional eutectic mixture solder and lead-free solder (Sn/Ag/Cu, etc.).The 0603, 1608 and 1005 types provide 3 different shapes with identical resistance-temperature characteristics.By using layered internal electrode structure, product series provides a wide range of resistances - B constants and realized good stability of resistance value after soldering.

文档(Document)

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