处理器-酷睿处理器-CM8062300834302

参数	数值
# of Cores	4
# of Displays Supported	2
# of Memory Channels	2
# of PCI Express Ports	1
# of Threads	8
AES New Instructions	Yes
Bus/Core Ratio	34
Clock Speed	3.4 GHz
Datasheet Url	Link
DMI	5 GT/s
Dual Display Capable	Yes
ECC Memory Supported	No
Embedded Options Available	Yes
Enhanced Intel SpeedStep® Technology	Yes
Execute Disable Bit	Yes
Graphics Base Frequency	850 MHz
Graphics Max Dynamic Frequency	1.35 GHz
Idle States	Yes
Instruction Set	64-bit
Instruction Set Extensions	SSE4.1/4.2, AVX
Intel® 64	Yes
Intel® Clear Video HD Technology	Yes
Intel® Fast Memory Access	Yes
Intel® Flex Memory Access	Yes
Intel® Flexible Display Interface (Intel® FDI)	Yes
Intel® Hyper-Threading Technology	Yes
Intel® Insider™	Yes
Intel® InTru™ 3D Technology	Yes
Intel® Quick Sync Video	Yes
Intel® Smart Cache	8 MB
Intel® Trusted Execution Technology	Yes
Intel® Turbo Boost Technology	2.0
Intel® Virtualization Technology (VT-x)	Yes
Intel® Virtualization Technology for Directed I/O (VT-d)	Yes
Intel® vPro Technology	Yes
Intel® VT-x with Extended Page Tables (EPT)	Yes
Intel® Wireless Display	No
Launch Date	Q1'11
Lithography	32 nm
Low Halogen Options Available	See MDDS
Max CPU Configuration	1
Max Memory Bandwidth	21 GB/s
Max Memory Size (dependent on memory type)	32 GB
Max TDP	95 W
Max Turbo Frequency	3.8 GHz
Memory Types	DDR3-1066/1333
Package Size	37.5mm x 37.5mm
PCI Express Revision	2.0
Processor Graphics	Intel® HD Graphics 2000
Processor Number	i7-2600
Recommended Customer Price	TRAY: $294 BOX : $305
Sockets Supported	LGA1155
Status	Launched
T CASE	72.6°C
Thermal Monitoring Technologies	Yes

这些基于英特尔® 微体系（代号：Sandy Bridge）的处理器支持四核和双核配置，可增强媒体和图形功能、降低平台的整体能耗和空闲能耗。观看视频。

英特尔® 高级矢量扩展： 为信号和图形处理应用加快计算处理速度。
英特尔® 高速视频同步技术： 提高媒体性能、为其它任务提供 CPU 可用性。
英特尔® 睿频加速技术 2.0： 以更高的频率来提高应用程序运行速度。
英特尔® 博锐™ 技术： 为关键的安全性和管理功能提供前所未有的硬件支持。

交互式结构图

文档(Document)

CM8062300834302

交互式结构图

文档(Document)

所有产品

应用方案

新闻中心

关于科通

序号	PDF	描述
1	" 产品简介：英特尔® 奔腾® 处理器 G850 与英特尔® C206，英特尔® Q67 Express，英特尔® B65 Express 和英特尔® H61 高速芯片组 "	" 产品简介：英特尔® 奔腾® 处理器 G850 与英特尔® C206，英特尔® Q67 Express，英特尔® B65 Express 和英特尔® H61 高速芯片组 "
2	Application Note: Embedded Scalable Platforms based on 2nd Generation Intel® Core™ Microarchitecture	Application Note: Embedded Scalable Platforms based on 2nd Generation Intel® Core™ Microarchitecture - System Bring-up Guide
3	Application Note: Intel® 82579LM Gigabit Ethernet PHY iSVR Inductor Selection	Application Note: Intel® 82579LM Gigabit Ethernet PHY iSVR Inductor Selection
4	Case Study: Intel® Technology Helps Medical Specialists More Quickly Reach-and Treat-Patients in Rem	Case Study: Intel® Technology Helps Medical Specialists More Quickly Reach-and Treat-Patients in Remote Areas
5	Datasheet: 2nd Generation Intel® Core™ Processor (Desktop) Family, Volume 1 of 2	Datasheet: 2nd Generation Intel® Core™ Processor (Desktop) Family, Volume 1 of 2
6	Datasheet: 2nd Generation Intel® Core™ Processor (Desktop) Family, Volume 2 of 2	Datasheet: 2nd Generation Intel® Core™ Processor (Desktop) Family, Volume 2 of 2
7	Datasheet: Intel® 6 Series and Intel® C200 Series Chipset	Datasheet: Intel® 6 Series and Intel® C200 Series Chipset
8	Datasheet: Intel® 82579 Gigabit Ethernet PHY	Datasheet: Intel® 82579 Gigabit Ethernet PHY
9	Schematic: Intel® 82579 Gigabit Ethernet PHY	Schematic: Intel® 82579 Gigabit Ethernet PHY
10	Solution Brief: Going Beyond Exceptional Computing Performance	Solution Brief: Going Beyond Exceptional Computing Performance
11	Specification Update: 2nd Generation Intel® Core™ Processor (Desktop) Family	Specification Update: 2nd Generation Intel® Core™ Processor (Desktop) Family
12	Specification Update: Intel® 6 Series and Intel® C200 Series Chipset	Specification Update: Intel® 6 Series and Intel® C200 Series Chipset
13	Thermal Mechanical Specifications and Design Guidelines (TMSDG): 2nd Generation Intel® Core™ Process	Thermal Mechanical Specifications and Design Guidelines (TMSDG): 2nd Generation Intel® Core™ Processor (Desktop) Family and LGA1155 Socket
14	Thermal Mechanical Specifications and Design Guidelines (TMSDG): Intel® 6 Series and Intel® C200 Ser	Thermal Mechanical Specifications and Design Guidelines (TMSDG): Intel® 6 Series and Intel® C200 Series Chipset
15	White Paper: Considerations for Designing an Embedded IA System with DDR3 SO-DIMMs	White Paper: Considerations for Designing an Embedded IA System with DDR3 SO-DIMMs
16	White Paper: Cryptographic Performance on the 2nd Generation Intel® Core™ Processor Family	White Paper: Cryptographic Performance on the 2nd Generation Intel® Core™ Processor Family
17	White Paper: Debugging Machine Check Exceptions on Embedded IA Platforms	White Paper: Debugging Machine Check Exceptions on Embedded IA Platforms
18	White Paper: Designing Real-Time Solutions on Embedded Intel® Architecture Processors	White Paper: Designing Real-Time Solutions on Embedded Intel® Architecture Processors
19	White Paper: Generating More Vending Machine Revenue with Digital Signage and Video Analytics	White Paper: Generating More Vending Machine Revenue with Digital Signage and Video Analytics
20	White Paper: High Performance DEFLATE Decompression on Intel® Architecture Processors	White Paper: High Performance DEFLATE Decompression on Intel® Architecture Processors
21	White Paper: High Performance Storage Encryption on Intel® Architecture Processors	White Paper: High Performance Storage Encryption on Intel® Architecture Processors
22	White Paper: Intel® Virtualization Technology for Directed I/O	White Paper: Intel® Virtualization Technology for Directed I/O
23	White Paper: Optimized Galois-Counter-Mode implementation on Intel® Architecture processors	White Paper: Optimized Galois-Counter-Mode implementation on Intel® Architecture processors
24	White Paper: Platform-Level error Handling Strategies for Intel® Systems	White Paper: Platform-Level error Handling Strategies for Intel® Systems
25	White Paper: Using Intel® AES New Instructions and PCLMULQDQ to Significantly Improve IPSec Performa	White Paper: Using Intel® AES New Instructions and PCLMULQDQ to Significantly Improve IPSec Performance on Linux*
26	产品简介：面向嵌入式计算的基于第二代智能英特尔® 酷睿™ i7-2600、英特尔® 酷睿™ i5-2400 和英特尔® 酷睿™ i3-2120 处理器的平台	产品简介：面向嵌入式计算的基于第二代智能英特尔® 酷睿™ i7-2600、英特尔® 酷睿™ i5-2400 和英特尔® 酷睿™ i3-2120 处理器的平台
27	产品简介：英特尔®赛扬®处理器G540 配合英特尔® C206、英特尔® Q67高速芯片组、英特尔® B65高速芯片组和英特尔® H61高速芯片组	产品简介：英特尔®赛扬®处理器G540 配合英特尔® C206、英特尔® Q67高速芯片组、英特尔® B65高速芯片组和英特尔® H61高速芯片组