处理器-凌动处理器-CH80566EC005DW

参数	数值
# of Cores	1
# of Processing Die Transistors	47 million
# of Threads	2
Bus/Core Ratio	11
Clock Speed	1.1 GHz
Embedded Options Available	Yes
Enhanced Intel SpeedStep® Technology	Yes
Execute Disable Bit	Yes
FSB Parity	No
FSB Speed	400 MHz
Idle States	Yes
Instruction Set	32-bit
Instruction Set Extensions	SSE2, SSE3, SSSE3
Intel® 64	No
Intel® Demand Based Switching	No
Intel® Hyper-Threading Technology	Yes
Intel® Trusted Execution Technology	No
Intel® Turbo Boost Technology	No
Intel® Virtualization Technology (VT-x)	No
Intel® Virtualization Technology for Directed I/O (VT-d)	No
L2 Cache	512 KB
Launch Date	Q2'08
Lithography	45 nm
Low Halogen Options Available	See MDDS
Max TDP	2.2 W
Package Size	22mm x 22mm
Processing Die Size	26 mm 2
Processor Number	Z510P
Recommended Customer Price	TRAY: $20
Sockets Supported	FCBGA437
Status	Launched
Supplemental SKU	No
T JUNCTION	90°C
Thermal Monitoring Technologies	Yes
VID Voltage Range	0.8V-1.1V

这些单核处理器有两种封装大小可选用，均具备出色的能源管理技术以增强散热限制和无风扇嵌入式应用的功能。此双芯片平台对车载信息娱乐系统、工业控制、媒体电话和交易解决方案等是理想的选择。

英特尔® 超线程技术： 顺序管线计算方式提供很高的性能/功耗效率。
能耗优化： 支持 C6 — 深度节能状态、分裂 VTT 导轨、增强的英特尔 SpeedStep® 技术和动态二级高速缓存调整
英特尔® 单指令多数据流扩展 3： 在复杂计算和视频解码中加快数据处理速度
外形： 双芯片平台有大小两种外形可用

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CH80566EC005DW

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2	Application Note: Embedded Customization to Support VBIOS Startup Screen on Portrait Panels for XP*	Application Note: Embedded Customization to Support VBIOS Startup Screen on Portrait Panels for XP*
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5	Datasheet: Intel® 82574 GbE Controller Family	Datasheet: Intel® 82574 GbE Controller Family
6	Datasheet: Intel® 82583V Gigabit Ethernet Controller	Datasheet: Intel® 82583V Gigabit Ethernet Controller
7	Datasheet: Intel® Atom™ Processor Z5xx Series (large form factor)	Datasheet: Intel® Atom™ Processor Z5xx Series (large form factor)
8	Datasheet: Intel® Atom™ Processor Z5xx Series (small form factor)	Datasheet: Intel® Atom™ Processor Z5xx Series (small form factor)
9	Datasheet: Intel® System Controller Hub (Intel® SCH)	Datasheet: Intel® System Controller Hub (Intel® SCH)
10	Datasheet: Intel® System Controller Hub (Intel® SCH) (large form factor)	Datasheet: Intel® System Controller Hub (Intel® SCH) (large form factor)
11	Intel® Technology Journal: Performance Analysis of the Intel® System Controller Hub (Intel® SCH) US1	Intel® Technology Journal: Performance Analysis of the Intel® System Controller Hub (Intel® SCH) US15W
12	Power Profiling for Embedded Applications	Power Profiling for Embedded Applications
13	Product Brief: Intel® 82574L and 82574IT Gigabit Ethernet Controllers	Product Brief: Intel® 82574L and 82574IT Gigabit Ethernet Controllers
14	Product Brief: Intel® 82574L and 82574IT Gigabit Ethernet Controllers	Product Brief: Intel® 82574L and 82574IT Gigabit Ethernet Controllers
15	Product Brief: Intel® 82583V Gigabit Ethernet Controller	Product Brief: Intel® 82583V Gigabit Ethernet Controller
16	Product Brief: Intel® 82583V Gigabit Ethernet Controller	Product Brief: Intel® 82583V Gigabit Ethernet Controller
17	Solution Brief: Smart Vending System— Dispensing Higher Profits Through Smart Technology	Solution Brief: Smart Vending System— Dispensing Higher Profits Through Smart Technology
18	Specification Update: Intel® 82574 GbE Controller Family	Specification Update: Intel® 82574 GbE Controller Family
19	Specification Update: Intel® 82583V Gigabit Ethernet Controller	Specification Update: Intel® 82583V Gigabit Ethernet Controller
20	Specification Update: Intel® Atom™ Processor Z5xx Series (large and small form factors)	Specification Update: Intel® Atom™ Processor Z5xx Series (large and small form factors)
21	Specification Update: Intel® System Controller Hub (Intel® SCH) (large and small form factors)	Specification Update: Intel® System Controller Hub (Intel® SCH) (large and small form factors)
22	User Manual: Intel® Atom™ Processor and Intel® System Controller Hub US15W Development Kit	User Manual: Intel® Atom™ Processor and Intel® System Controller Hub US15W Development Kit
23	White Paper: Accessing PCI Express* Registers When Using Intel® Chipsets	White Paper: Accessing PCI Express* Registers When Using Intel® Chipsets
24	White Paper: Choosing the Right Storage Solution for Your Embedded Application	White Paper: Choosing the Right Storage Solution for Your Embedded Application
25	White Paper: DDR Signal Integrity (SI) Simulation Process for Intel® Architecture Platforms	White Paper: DDR Signal Integrity (SI) Simulation Process for Intel® Architecture Platforms
26	White Paper: Designing Systems without a Suspend Supply	White Paper: Designing Systems without a Suspend Supply
27	White Paper: Embedded Intel® Architecture and High Speed Digital Design Principles	White Paper: Embedded Intel® Architecture and High Speed Digital Design Principles
28	White Paper: Fanless Cooling for Embedded Applications	White Paper: Fanless Cooling for Embedded Applications
29	White Paper: Fanless Cooling for Embedded Applications	White Paper: Fanless Cooling for Embedded Applications
30	White Paper: Fastboot BIOS	White Paper: Fastboot BIOS
31	White Paper: Hardware Level I/O Benchmarking of PCI Express on Intel® Platforms	White Paper: Hardware Level I/O Benchmarking of PCI Express on Intel® Platforms
32	White Paper: How to Design a Solar-Powered Computing Device (large and small form factors)	White Paper: How to Design a Solar-Powered Computing Device (large and small form factors)
33	White Paper: How to Properly Measure Cache Latency, Memory Latency, and CPU to Memory Bandwidth on I	White Paper: How to Properly Measure Cache Latency, Memory Latency, and CPU to Memory Bandwidth on Intel® Architecture
34	White Paper: How to Properly Measure Cache Latency, Memory Latency, and CPU to Memory Bandwidth on I	White Paper: How to Properly Measure Cache Latency, Memory Latency, and CPU to Memory Bandwidth on Intel® Architecture
35	White Paper: Interfacing I²C Devices to Intel's SMBus Controller	White Paper: Interfacing I²C Devices to Intel's SMBus Controller
36	White Paper: JTAG 101	White Paper: JTAG 101
37	White Paper: Layer 3 Forwarding and IPSec Measurement and Optimization	White Paper: Layer 3 Forwarding and IPSec Measurement and Optimization
38	White Paper: PCB Stackup Overview for Intel® Architecture Platforms—Layout and Signal Integrity Cons	White Paper: PCB Stackup Overview for Intel® Architecture Platforms—Layout and Signal Integrity Considerations
39	White Paper: Platform-Level error Handling Strategies for Intel® Systems	White Paper: Platform-Level error Handling Strategies for Intel® Systems
40	White Paper: Power Delivery for Embedded Intel® Atom™ Platforms	White Paper: Power Delivery for Embedded Intel® Atom™ Platforms
41	White Paper: Reducing Interrupt Latency in Embedded Systems through Message Signaled Interrupts	White Paper: Reducing Interrupt Latency in Embedded Systems through Message Signaled Interrupts
42	White Paper: Signal Integrity Pitfalls When You Deviate from Intel Design Guidelines	White Paper: Signal Integrity Pitfalls When You Deviate from Intel Design Guidelines
43	White Paper: Smart Service Companion - Intel® Atom™ Z5xx Platform-based Self-Service Device	White Paper: Smart Service Companion - Intel® Atom™ Z5xx Platform-based Self-Service Device
44	White Paper: Thermal Design Considerations for Embedded Applications	White Paper: Thermal Design Considerations for Embedded Applications
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