处理器-酷睿处理器-AW8063801116102

参数	数值
Description	ECC memory support only on BGA package
# of Cores	2
# of Displays Supported	3
# of Memory Channels	2
# of PCI Express Ports	1
# of Threads	4
4G WiMAX Wireless Technology	No
AES New Instructions	Yes
Bus/Core Ratio	27
Clock Speed	2.7 GHz
DMI	5 GT/s
Dual Display Capable	Yes
ECC Memory Supported	Yes
Embedded Options Available	Yes
Enhanced Intel SpeedStep® Technology	Yes
Execute Disable Bit	Yes
Graphics and IMC Lithography	22nm
Graphics Base Frequency	650 MHz
Graphics Max Dynamic Frequency	950 MHz
Graphics Output	eDP/DP/HDMI/SDVO/CRT
Idle States	Yes
Instruction Set	64-bit
Instruction Set Extensions	AVX
Intel® 64	Yes
Intel® Anti-Theft Technology	No
Intel® Clear Video HD Technology	Yes
Intel® Clear Video Technology for MID	No
Intel® Demand Based Switching	No
Intel® Fast Memory Access	Yes
Intel® Flex Memory Access	Yes
Intel® Flexible Display Interface (Intel® FDI)	Yes
Intel® Hyper-Threading Technology	Yes
Intel® Insider™	No
Intel® InTru™ 3D Technology	Yes
Intel® My WiFi Technology	Yes
Intel® Quick Sync Video	Yes
Intel® Smart Cache	3 MB
Intel® Trusted Execution Technology	Yes
Intel® Turbo Boost Technology	2.0
Intel® Virtualization Technology (VT-x)	Yes
Intel® Virtualization Technology for Directed I/O (VT-d)	Yes
Intel® Virtualization Technology for Itanium (VT-i)	No
Intel® vPro Technology	Yes
Intel® VT-x with Extended Page Tables (EPT)	Yes
Intel® Wireless Display	No
Launch Date	Q2'12
Lithography	22nm
Low Halogen Options Available	See MDDS
Max CPU Configuration	1
Max Memory Bandwidth	25.6 GB/s
Max Memory Size (dependent on memory type)	32 GB
Max TDP	35 W
Max Turbo Frequency	3.3 MHz
Memory Types	DDR3/DDR3L 1333/1600
Package Size	37.5mmx 37.5mm PGA
PCI Express Configurations	1x16 2x8 1x8 2x4
PCI Express Revision	3.0
Processor Graphics	Intel® HD Graphics 4000
Processor Number	i5-3610ME
Recommended Customer Price	TRAY: $276
Sockets Supported	FCBGA1023, FCPGA988
Status	Launched
T JUNCTION	105°C
Thermal Monitoring Technologies	Yes

这些低功耗处理器基于原名为 Ivy Bridge 的英特尔® 微体系结构，后者采用具有 3D 晶体管的 22 纳米处理技术。此平台提供了高性能、远程可管理性和安全性、ECC 内存和节能功能，是各种不同的移动智能应用程序的理想选择。

采用英特尔® 核芯显卡 4000/2500： 提供增强型视觉体验，包括非凡的 3D 性能以及三台独立显示器的支持。
英特尔® 高速视频同步技术： 显著提升解码和转码性能并腾出 CPU 用于其他任务。
新一代 I/O： 更快连接，而且支持集成型 PCI Express 第三代和 USB 3.0。
英特尔® 博锐™ 技术： 为关键的安全性和远程管理功能提供前所未有的硬件支持。
英特尔® 智能节能技术： 通过诸如集成功率门限和自动低功耗状态等架构方面的提高以降低闲置功耗。

交互式结构图

文档(Document)

序号	PDF	描述
1	Application Note: Intel® 82579LM Gigabit Ethernet PHY iSVR Inductor Selection	Application Note: Intel® 82579LM Gigabit Ethernet PHY iSVR Inductor Selection
2	Application Power Guideline Addendum: 3rd Generation Intel® Core™ i7 Processor	Application Power Guideline Addendum: 3rd Generation Intel® Core™ i7 Processor
3	Datasheet: 3rd Generation Intel® Core™ Processor (Mobile) Family - Volume 1 of 2	Datasheet: 3rd Generation Intel® Core™ Processor (Mobile) Family - Volume 1 of 2
4	Datasheet: 3rd Generation Intel® Core™ Processor (Mobile) Family - Volume 2 of 2	Datasheet: 3rd Generation Intel® Core™ Processor (Mobile) Family - Volume 2 of 2
5	Datasheet: Intel® 7 Series and Intel® C216 Chipset	Datasheet: Intel® 7 Series and Intel® C216 Chipset
6	Datasheet: Intel® 82579 Gigabit Ethernet PHY	Datasheet: Intel® 82579 Gigabit Ethernet PHY
7	Schematic: Intel® 82579 Gigabit Ethernet PHY	Schematic: Intel® 82579 Gigabit Ethernet PHY
8	Specification Update: 3rd Generation Intel® Core™ Processor (Mobile) Family	Specification Update: 3rd Generation Intel® Core™ Processor (Mobile) Family
9	Specification Update: Intel® 7 Series and Intel® C216 Chipset	Specification Update: Intel® 7 Series and Intel® C216 Chipset
10	White Paper: Improved Graphics Performance Changes the Cost Equation in Digital Signage	White Paper: Improved Graphics Performance Changes the Cost Equation in Digital Signage
11	平台简介:采用移动式英特尔® HM76 和 QM77 高速芯片组的智能英特尔® 酷睿™ i7 和酷睿™ i5 处理器	平台简介:采用移动式英特尔® HM76 和 QM77 高速芯片组的智能英特尔® 酷睿™ i7 和酷睿™ i5 处理器

AW8063801116102

交互式结构图

文档(Document)

所有产品

应用方案

新闻中心

关于科通