处理器-酷睿处理器-AV8062701082300

参数	数值
# of Cores	1
# of Displays Supported	2
# of Memory Channels	2
# of PCI Express Ports	16
# of Threads	1
4G WiMAX Wireless Technology	No
AES New Instructions	No
Bus/Core Ratio	14
Clock Speed	1.4 GHz
Datasheet Url	Link
Dual Display Capable	Yes
ECC Memory Supported	Yes
Embedded Options Available	Yes
Enhanced Intel SpeedStep® Technology	Yes
Graphics and IMC Lithography	32nm
Graphics Base Frequency	350 MHz
Graphics Max Dynamic Frequency	800 MHz
Graphics Output	eDP/DP/HDMI/SDVO/CRT
Idle States	Yes
Instruction Set	64-bit
Intel® 64	Yes
Intel® Anti-Theft Technology	No
Intel® Clear Video HD Technology	No
Intel® Demand Based Switching	No
Intel® Fast Memory Access	Yes
Intel® Flex Memory Access	Yes
Intel® Hyper-Threading Technology	No
Intel® InTru™ 3D Technology	No
Intel® My WiFi Technology	No
Intel® Quick Sync Video	No
Intel® Smart Cache	1.5 MB
Intel® Trusted Execution Technology	No
Intel® Turbo Boost Technology	No
Intel® Virtualization Technology (VT-x)	Yes
Intel® Virtualization Technology for Directed I/O (VT-d)	No
Intel® vPro Technology	No
Intel® Wireless Display	No
Launch Date	Q3'11
Lithography	32 nm
Low Halogen Options Available	See MDDS
Macrovision* License Required	No
Max Memory Bandwidth	21.3 GB/s
Max Memory Size (dependent on memory type)	16 GB
Max TDP	17 W
Memory Types	DDR3-1066/1333
Package Size	31mm x 24mm (FCBGA1023)
PCI Express Configurations	1x16, 2x8, 1x8 2x4
PCI Express Revision	2.0
Processor Graphics	Intel® HD Graphics
Processor Number	827E
Recommended Customer Price	TRAY: $107
Sockets Supported	FCBGA1023
Status	Launched
T JUNCTION	100
Thermal Monitoring Technologies	Yes

这些低功耗处理器基于采用 32 纳米技术的英特尔® 微体系（代号：Sandy Bridge）。此平台提供了高性能、远程可管理性和安全性、ECC 和节能功能，是各种不同的嵌入式应用程序的理想选择。

英特尔® 高级矢量扩展： 加速浮点计算的性能。
英特尔® 核芯显卡 3000 和英特尔® 快速同步视频： 支持高端增强视频和图形功能，并提高性能。
英特尔® 睿频加速技术 2.0： 利用可用的温度余地以更高的频率更快地运行应用程序。
英特尔® 博锐™ 技术： 为关键的安全性和远程管理功能提供前所未有的硬件支持。

交互式结构图

文档(Document)

AV8062701082300

交互式结构图

文档(Document)

所有产品

应用方案

新闻中心

关于科通

序号	PDF	描述
1	Application Note: Intel® 82579LM Gigabit Ethernet PHY iSVR Inductor Selection	Application Note: Intel® 82579LM Gigabit Ethernet PHY iSVR Inductor Selection
2	Application Power Guideline Addendum: 2nd Generation Intel® Core™ i7-2715QE Processor	Application Power Guideline Addendum: 2nd Generation Intel® Core™ i7-2715QE Processor
3	Application Power Guideline Addendum: Intel® Celeron® Processor 807UE	Application Power Guideline Addendum: Intel® Celeron® Processor 807UE
4	Application Power Guideline Addendum: Intel® Celeron® Processor 827E	Application Power Guideline Addendum: Intel® Celeron® Processor 827E
5	Datasheet Addendum: 2nd Generation Intel® Core™ Processor Family Mobile with ECC	Datasheet Addendum: 2nd Generation Intel® Core™ Processor Family Mobile with ECC
6	Datasheet: 2nd Generation Intel® Core™ Processor (Mobile) Family—Volume 1 of 2	Datasheet: 2nd Generation Intel® Core™ Processor (Mobile) Family—Volume 1 of 2
7	Datasheet: 2nd Generation Intel® Core™ Processor (Mobile) Family—Volume 2 of 2	Datasheet: 2nd Generation Intel® Core™ Processor (Mobile) Family—Volume 2 of 2
8	Datasheet: Intel® 6 Series and Intel® C200 Series Chipset	Datasheet: Intel® 6 Series and Intel® C200 Series Chipset
9	Datasheet: Intel® 82579 Gigabit Ethernet PHY	Datasheet: Intel® 82579 Gigabit Ethernet PHY
10	Schematic: Intel® 82579 Gigabit Ethernet PHY	Schematic: Intel® 82579 Gigabit Ethernet PHY
11	Solution Brief: Going Beyond Exceptional Computing Performance	Solution Brief: Going Beyond Exceptional Computing Performance
12	Specification Update: 2nd Generation Intel® Core™ Processor (Mobile) Family	Specification Update: 2nd Generation Intel® Core™ Processor (Mobile) Family
13	Specification Update: Intel® 6 Series and Intel® C200 Series Chipset	Specification Update: Intel® 6 Series and Intel® C200 Series Chipset
14	Thermal Design Guide: 2nd Generation Intel® Core™ Processor (Mobile) Family	Thermal Design Guide: 2nd Generation Intel® Core™ Processor (Mobile) Family
15	Thermal Mechanical Specifications and Design Guidelines (TMSDG): Intel® 6 Series and Intel® C200 Ser	Thermal Mechanical Specifications and Design Guidelines (TMSDG): Intel® 6 Series and Intel® C200 Series Chipset
16	User Guide: 2nd Generation Intel® Core™ Processor Family with Intel® 6 Series Chipset Development Ki	User Guide: 2nd Generation Intel® Core™ Processor Family with Intel® 6 Series Chipset Development Kit
17	White Paper: Considerations for Designing an Embedded IA System with DDR3 SO-DIMMs	White Paper: Considerations for Designing an Embedded IA System with DDR3 SO-DIMMs
18	White Paper: Cryptographic Performance on the 2nd Generation Intel® Core™ Processor Family	White Paper: Cryptographic Performance on the 2nd Generation Intel® Core™ Processor Family
19	White Paper: Debugging Machine Check Exceptions on Embedded IA Platforms	White Paper: Debugging Machine Check Exceptions on Embedded IA Platforms
20	White Paper: Designing Real-Time Solutions on Embedded Intel® Architecture Processors	White Paper: Designing Real-Time Solutions on Embedded Intel® Architecture Processors
21	White Paper: High Performance DEFLATE Decompression on Intel® Architecture Processors	White Paper: High Performance DEFLATE Decompression on Intel® Architecture Processors
22	White Paper: High Performance Storage Encryption on Intel® Architecture Processors	White Paper: High Performance Storage Encryption on Intel® Architecture Processors
23	White Paper: Intel® Virtualization Technology for Directed I/O	White Paper: Intel® Virtualization Technology for Directed I/O
24	White Paper: Optimized Galois-Counter-Mode implementation on Intel® Architecture processors	White Paper: Optimized Galois-Counter-Mode implementation on Intel® Architecture processors
25	White Paper: Platform-Level error Handling Strategies for Intel® Systems	White Paper: Platform-Level error Handling Strategies for Intel® Systems
26	White Paper: Using Intel® AES New Instructions and PCLMULQDQ to Significantly Improve IPSec Performa	White Paper: Using Intel® AES New Instructions and PCLMULQDQ to Significantly Improve IPSec Performance on Linux*
27	产品简介：第二代英特尔® 酷睿™ i7-2710QE 处理器与英特尔® QM67 高速芯片组开发套件	产品简介：第二代英特尔® 酷睿™ i7-2710QE 处理器与英特尔® QM67 高速芯片组开发套件
28	产品简介：第二代智能英特尔® 酷睿™ i7 处理器系列与英特尔® QM67 高速芯片组开发套件	产品简介：第二代智能英特尔® 酷睿™ i7 处理器系列与英特尔® QM67 高速芯片组开发套件
29	平台简介：英特尔® 赛扬® 处理器 B810 与移动式英特尔® QM67 高速芯片组和移动式英特尔® HM65 高速芯片组	平台简介：英特尔® 赛扬® 处理器 B810 与移动式英特尔® QM67 高速芯片组和移动式英特尔® HM65 高速芯片组
30	平台简介：采用英特尔® QM67 高速芯片组和英特尔® HM65 高速芯片组的第二代英特尔® 酷睿™ i7、酷睿™ i5 和酷睿™ i3 处理器。	平台简介：采用英特尔® QM67 高速芯片组和英特尔® HM65 高速芯片组的第二代英特尔® 酷睿™ i7、酷睿™ i5 和酷睿™ i3 处理器。