序号 |
PDF |
描述 |
1 |
"用于嵌入式计算的英特尔® 酷睿™ 2 双核处理器 T9400、P8400、SL9400、SL9380、SP9300、SU9300、T7500、 T7400、L7500、L7400 和 U7500 处
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"用于嵌入式计算的英特尔® 酷睿™ 2 双核处理器 T9400、P8400、SL9400、SL9380、SP9300、SU9300、T7500、 T7400、L7500、L7400 和 U7500 处理器" |
2 |
Application Note: Designing Embedded Systems for Testability
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Application Note: Designing Embedded Systems for Testability |
3 |
Datasheet: Intel® 82574 GbE Controller Family
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Datasheet: Intel® 82574 GbE Controller Family |
4 |
Datasheet: Intel® Celeron® Processor 900 Series and Ultra Low Voltage 700 Series
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Datasheet: Intel® Celeron® Processor 900 Series and Ultra Low Voltage 700 Series |
5 |
Datasheet: Intel® I/O Controller Hub 9 (ICH9) Family
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Datasheet: Intel® I/O Controller Hub 9 (ICH9) Family |
6 |
Intel® Core™2 Duo Mobile Processor, Intel® Core™2 Solo Mobile Processor and Mobile Processor, Intel®
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Intel® Core™2 Duo Mobile Processor, Intel® Core™2 Solo Mobile Processor and Mobile Processor, Intel® Core™2 Extreme Mobile Processor on 45-nm Process |
7 |
Intel® Core™2 Duo Processor and Intel® GM45 Express Chipset (with DDR2 System Memory) Development Ki
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Intel® Core™2 Duo Processor and Intel® GM45 Express Chipset (with DDR2 System Memory) Development Kit User Manual |
8 |
Intel® Core™2 Duo Processor and Intel® GM45 Express Chipset (with DDR3 System Memory) Development Ki
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Intel® Core™2 Duo Processor and Intel® GM45 Express Chipset (with DDR3 System Memory) Development Kit User Manual |
9 |
Intel® Core™2 Duo Processors on 45-nm Process Processor for Embedded Applications Thermal Design Gui
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Intel® Core™2 Duo Processors on 45-nm Process Processor for Embedded Applications Thermal Design Guide |
10 |
Mobile Intel® 4 Series Express Chipset Family
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Mobile Intel® 4 Series Express Chipset Family |
11 |
Power Profiling for Embedded Applications
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Power Profiling for Embedded Applications |
12 |
Presentation: Image Signal Processing Performance on 2nd Generation Core™ Microarchitecture
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Presentation: Image Signal Processing Performance on 2nd Generation Core™ Microarchitecture |
13 |
Product Brief: Intel® 82574L and 82574IT Gigabit Ethernet Controllers
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Product Brief: Intel® 82574L and 82574IT Gigabit Ethernet Controllers |
14 |
Product Brief: Intel® 82574L and 82574IT Gigabit Ethernet Controllers
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Product Brief: Intel® 82574L and 82574IT Gigabit Ethernet Controllers |
15 |
Solution Brief: Unwiring the Patient — Using Intel® technologies to create a wireless sensor platfor
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Solution Brief: Unwiring the Patient — Using Intel® technologies to create a wireless sensor platform for hospitals |
16 |
Specification Update: Intel® 4 Series Express Chipset
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Specification Update: Intel® 4 Series Express Chipset |
17 |
Specification Update: Intel® 82574 GbE Controller Family
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Specification Update: Intel® 82574 GbE Controller Family |
18 |
White Paper: Accessing PCI Express* Registers When Using Intel® Chipsets
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White Paper: Accessing PCI Express* Registers When Using Intel® Chipsets |
19 |
White Paper: Asymmetric Multi-Processing, Embedded and Communication MC Usage Model
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White Paper: Asymmetric Multi-Processing, Embedded and Communication MC Usage Model |
20 |
White Paper: Choosing the Right Storage Solution for Your Embedded Application
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White Paper: Choosing the Right Storage Solution for Your Embedded Application |
21 |
White Paper: Considerations for Designing an Embedded IA System with DDR3 SO-DIMMs
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White Paper: Considerations for Designing an Embedded IA System with DDR3 SO-DIMMs |
22 |
White Paper: DDR Signal Integrity (SI) Simulation Process for Intel® Architecture Platforms
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White Paper: DDR Signal Integrity (SI) Simulation Process for Intel® Architecture Platforms |
23 |
White Paper: Debugging Machine Check Exceptions on Embedded IA Platforms
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White Paper: Debugging Machine Check Exceptions on Embedded IA Platforms |
24 |
White Paper: Designing Systems without a Suspend Supply
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White Paper: Designing Systems without a Suspend Supply |
25 |
White Paper: Embedded Intel® Architecture and High Speed Digital Design Principles
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White Paper: Embedded Intel® Architecture and High Speed Digital Design Principles |
26 |
White Paper: Hardware Level I/O Benchmarking of PCI Express on Intel® Platforms
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White Paper: Hardware Level I/O Benchmarking of PCI Express on Intel® Platforms |
27 |
White Paper: How to Properly Measure Cache Latency, Memory Latency, and CPU to Memory Bandwidth on I
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White Paper: How to Properly Measure Cache Latency, Memory Latency, and CPU to Memory Bandwidth on Intel® Architecture |
28 |
White Paper: How to Properly Measure Cache Latency, Memory Latency, and CPU to Memory Bandwidth on I
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White Paper: How to Properly Measure Cache Latency, Memory Latency, and CPU to Memory Bandwidth on Intel® Architecture |
29 |
White Paper: Interfacing I²C Devices to Intel's SMBus Controller
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White Paper: Interfacing I²C Devices to Intel's SMBus Controller |
30 |
White Paper: JTAG 101
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White Paper: JTAG 101 |
31 |
White Paper: Layer 3 Forwarding and IPSec Measurement and Optimization
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White Paper: Layer 3 Forwarding and IPSec Measurement and Optimization |
32 |
White Paper: PCB Stackup Overview for Intel® Architecture Platforms—Layout and Signal Integrity Cons
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White Paper: PCB Stackup Overview for Intel® Architecture Platforms—Layout and Signal Integrity Considerations |
33 |
White Paper: Platform-Level error Handling Strategies for Intel® Systems
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White Paper: Platform-Level error Handling Strategies for Intel® Systems |
34 |
White Paper: Programming Models for Packet Processing Applications on Multi-Core Intel® Architecture
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White Paper: Programming Models for Packet Processing Applications on Multi-Core Intel® Architecture Systems |
35 |
White Paper: Reducing Interrupt Latency in Embedded Systems through Message Signaled Interrupts
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White Paper: Reducing Interrupt Latency in Embedded Systems through Message Signaled Interrupts |
36 |
White Paper: Seven Tips to Get Started on Embedded Multi-Core
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White Paper: Seven Tips to Get Started on Embedded Multi-Core |
37 |
White Paper: Signal Integrity Pitfalls When You Deviate from Intel Design Guidelines
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White Paper: Signal Integrity Pitfalls When You Deviate from Intel Design Guidelines |
38 |
White Paper: Thermal Design Considerations for Embedded Applications
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White Paper: Thermal Design Considerations for Embedded Applications |
39 |
White Paper: Upgrading to Multi-Core Ecosystem Keeps Car Simulator Running in the Fast Lane
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White Paper: Upgrading to Multi-Core Ecosystem Keeps Car Simulator Running in the Fast Lane |
40 |
White Paper: Using Intel® Processors for DSP Applications: Comparing the Performance of Freescale MP
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White Paper: Using Intel® Processors for DSP Applications: Comparing the Performance of Freescale MPC8641D* and Two Intel® Core™2 Duo Processors |
41 |
面向嵌入式计算的45 纳米英特尔® 赛扬®和
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面向嵌入式计算的45 纳米英特尔® 赛扬®和 |
42 |
英特尔® 酷睿™2 双核处理器和移动式英特尔® 4 高速芯片组系列开发套件 高速芯片组系列开发套件
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英特尔® 酷睿™2 双核处理器和移动式英特尔® 4 高速芯片组系列开发套件 高速芯片组系列开发套件 |
43 |
英特尔® 赛扬® M 处理器 575
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英特尔® 赛扬® M 处理器 575 |
44 |
支持嵌入式计算的移动式英特尔® GM45、GS45 和 GL40 高速芯片组
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支持嵌入式计算的移动式英特尔® GM45、GS45 和 GL40 高速芯片组 |