处理器-凌动处理器-AU80586GE025D

参数	数值
# of Cores	1
# of Processing Die Transistors	47 million
# of Threads	2
Bus/Core Ratio	12
Clock Speed	1.6 GHz
Embedded Options Available	Yes
Enhanced Intel SpeedStep® Technology	Yes
Execute Disable Bit	Yes
FSB Parity	No
FSB Speed	533 MHz
Idle States	No
Instruction Set	32-bit
Instruction Set Extensions	SSE2, SSE3, SSSE4
Intel® 64	No
Intel® Demand Based Switching	No
Intel® Hyper-Threading Technology	Yes
Intel® Trusted Execution Technology	No
Intel® Turbo Boost Technology	No
Intel® Virtualization Technology (VT-x)	No
Intel® Virtualization Technology for Directed I/O (VT-d)	No
L2 Cache	512 KB
Launch Date	Q2'08
Lithography	45 nm
Low Halogen Options Available	See MDDS
Max TDP	2.5 W
Package Size	22mm x 22mm
Processing Die Size	26 mm 2
Processor Number	N270
Recommended Customer Price	TRAY: $32
Sockets Supported	PBGA437
Status	Launched
Supplemental SKU	No
T JUNCTION	90°C
Thermal Monitoring Technologies	Yes
VID Voltage Range	0.9V-1.1625V

基于 45 纳米技术的单核处理器（主频：1.6 GHz；TDP：2.5 瓦）经过能耗优化，可提供出色的性能功耗比。此平台提供丰富的 I/O 功能、32 位 3D 显卡和 DDR2 支持 — 是众多嵌入式市场领域的理想选择。

英特尔® 超线程技术： 在多任务环境中提高系统响应性能
能耗优化： 支持增强型英特尔 SpeedStep® 技术，低能耗睡眠状态（C1E、C2E、C4E）二级高速缓存动态调整
英特尔® 单指令多数据流扩展（SSE）2 和英特尔® SSE3： 在复杂计算和视频解码中加快数据处理速度

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序号	PDF	描述
1	Application Note: Designing Embedded Systems for Testability	Application Note: Designing Embedded Systems for Testability
2	Case Study: OpenPeak* Conversion from RISC Architecture with External DSP to Intel® Architecture Boo	Case Study: OpenPeak* Conversion from RISC Architecture with External DSP to Intel® Architecture Boosts Performance Up to 10X
3	Datasheet: Intel® 82583V Gigabit Ethernet Controller	Datasheet: Intel® 82583V Gigabit Ethernet Controller
4	Datasheet: Intel® I/O Controller Hub 7 (ICH7)	Datasheet: Intel® I/O Controller Hub 7 (ICH7)
5	Datasheet: Mobile Intel® Atom™ Processor N270 Single Core	Datasheet: Mobile Intel® Atom™ Processor N270 Single Core
6	Platform Overview: Intel® Atom™ Processor N270 and Mobile Intel® 945GSE Express Chipset-Based Platfo	Platform Overview: Intel® Atom™ Processor N270 and Mobile Intel® 945GSE Express Chipset-Based Platform
7	Power Profiling for Embedded Applications	Power Profiling for Embedded Applications
8	Product Brief: Intel® 82583V Gigabit Ethernet Controller	Product Brief: Intel® 82583V Gigabit Ethernet Controller
9	Product Brief: Intel® 82583V Gigabit Ethernet Controller	Product Brief: Intel® 82583V Gigabit Ethernet Controller
10	Solution Brief: Smart Vending System— Dispensing Higher Profits Through Smart Technology	Solution Brief: Smart Vending System— Dispensing Higher Profits Through Smart Technology
11	Specification Update: Intel® 82583V Gigabit Ethernet Controller	Specification Update: Intel® 82583V Gigabit Ethernet Controller
12	Specification Update: Intel® Atom™ Processor N270 Series	Specification Update: Intel® Atom™ Processor N270 Series
13	Specification Update: Intel® I/O Controller Hub 7 (ICH7) Family	Specification Update: Intel® I/O Controller Hub 7 (ICH7) Family
14	Thermal & Mechanical Design Guide: Intel® Atom™ Processor 200 Series	Thermal & Mechanical Design Guide: Intel® Atom™ Processor 200 Series
15	White Paper: Accessing PCI Express* Registers When Using Intel® Chipsets	White Paper: Accessing PCI Express* Registers When Using Intel® Chipsets
16	White Paper: Choosing the Right Storage Solution for Your Embedded Application	White Paper: Choosing the Right Storage Solution for Your Embedded Application
17	White Paper: DDR Signal Integrity (SI) Simulation Process for Intel® Architecture Platforms	White Paper: DDR Signal Integrity (SI) Simulation Process for Intel® Architecture Platforms
18	White Paper: Designing Systems without a Suspend Supply	White Paper: Designing Systems without a Suspend Supply
19	White Paper: Embedded Intel® Architecture and High Speed Digital Design Principles	White Paper: Embedded Intel® Architecture and High Speed Digital Design Principles
20	White Paper: Fanless Cooling for Embedded Applications	White Paper: Fanless Cooling for Embedded Applications
21	White Paper: Fanless Cooling for Embedded Applications	White Paper: Fanless Cooling for Embedded Applications
22	White Paper: Hardware Level I/O Benchmarking of PCI Express on Intel® Platforms	White Paper: Hardware Level I/O Benchmarking of PCI Express on Intel® Platforms
23	White Paper: How to Properly Measure Cache Latency, Memory Latency, and CPU to Memory Bandwidth on I	White Paper: How to Properly Measure Cache Latency, Memory Latency, and CPU to Memory Bandwidth on Intel® Architecture
24	White Paper: How to Properly Measure Cache Latency, Memory Latency, and CPU to Memory Bandwidth on I	White Paper: How to Properly Measure Cache Latency, Memory Latency, and CPU to Memory Bandwidth on Intel® Architecture
25	White Paper: Interfacing I²C Devices to Intel's SMBus Controller	White Paper: Interfacing I²C Devices to Intel's SMBus Controller
26	White Paper: JTAG 101	White Paper: JTAG 101
27	White Paper: Layer 3 Forwarding and IPSec Measurement and Optimization	White Paper: Layer 3 Forwarding and IPSec Measurement and Optimization
28	White Paper: PCB Stackup Overview for Intel® Architecture Platforms—Layout and Signal Integrity Cons	White Paper: PCB Stackup Overview for Intel® Architecture Platforms—Layout and Signal Integrity Considerations
29	White Paper: Platform-Level error Handling Strategies for Intel® Systems	White Paper: Platform-Level error Handling Strategies for Intel® Systems
30	White Paper: Reducing Interrupt Latency in Embedded Systems through Message Signaled Interrupts	White Paper: Reducing Interrupt Latency in Embedded Systems through Message Signaled Interrupts
31	White Paper: Signal Integrity Pitfalls When You Deviate from Intel Design Guidelines	White Paper: Signal Integrity Pitfalls When You Deviate from Intel Design Guidelines
32	White Paper: Thermal Design Considerations for Embedded Applications	White Paper: Thermal Design Considerations for Embedded Applications
33	产品简介：适用于嵌入式计算的移动式英特尔® 945GSE 高速芯片组	产品简介：适用于嵌入式计算的移动式英特尔® 945GSE 高速芯片组
34	英特尔® 凌动™ N270 处理器和移动式英特尔®945GSE 高速芯片组开发套件	英特尔® 凌动™ N270 处理器和移动式英特尔®945GSE 高速芯片组开发套件
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